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DEPOSITIONS & SUBSTRATES |
TOOL CHAMBERS & KITS BY PROCESS AREA |
| Depositions Cleaned • ETCH: All etch polymers & derivatives • CVD/PVD: Titanium, Titanium Nitride, Copper, Gold, SilOx, Tungsten Palladium, Platinum, TEOS, Vanadium • DIFFUSION: Oxide, Nitride, Polysilicon, TEOS • PHOTOLITHOGRAPHY: Polyamide, Polyimide, DUV, I-line, SOG • CMP: Robotics (cleaned & refurbed), slurry compatible passivation • Implant: Arsenic, Phosphorous, Boron Indium and other dopants Substrate Materials Cleaned • Ceramics • Quartz • Stainless Steel • Aluminum • Anodized Aluminum • Silicon Carbide • Quartz • Yttrium • Ceramics • Titanium, Graphites • …and more |
Etch • AMAT: MxP-5000 (Poly/Oxide/PON/Via/SALI/Cu), DPS Metal/Poly Etch, IPS, 8830, 490, • TEL: Unity and Telius (II, IIe, M, J, DRM, SCCM, Ceramic or Y2O3 coated), Telius • LAM: 4400, 4520, 4520i, 4520XL, 4520XLe, TCP 9400/9600, VerSys 2300 • Many more CVD/PVD • AMAT: Endura, Centura (Al, Ti, TiN, W, etc.) Pre-Clean II, CoTi, Cu, Al • TEL/MRC: Eclipse, Wafer Holder Assemblies • Ulvac: Al, Ti, TiN • Novellus: HDPE Concept II Speed, Sequel, • ASML/SVG: APCVD WJ 999/1000 & 1500 Diffusion • TEL, Kokusai/BTI, ASML/SVG Photolithography • TEL: TRACK ACT-8/12, AMAT: Mira Mesa; Semix, ASML/SVG 8600/8800/90, MTI • Coater Cups, Chuck Assemblies, Hot Plates, Buffer Tanks, etc Implant • Varian, Applied, Axcelis/Eaton, Genus (30 different Implant Sources and Assemblies) |
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